LICENSE

Solderpad Hardware License v2.1

This license operates as a wraparound license to the Apache License
Version 2.0 (the “Apache License”) and incorporates the terms and
conditions of the Apache License (which can be found here:
http://apache.org/licenses/LICENSE-2.0), with the following additions and
modifications. It must be read in conjunction with the Apache License.
Section 1 below modifies definitions and terminology in the Apache
License and Section 2 below replaces Section 2 of the Apache License.
The Appendix replaces the Appendix in the Apache License. You may, at
your option, choose to treat any Work released under this license as
released under the Apache License (thus ignoring all sections written
below entirely).

1. Terminology in the Apache License is supplemented or modified as
follows:

“Authorship”: any reference to ‘authorship’ shall be taken to read
“authorship or design”.

“Copyright owner”: any reference to ‘copyright owner’ shall be taken to
read “Rights owner”.

“Copyright statement”: the reference to ‘copyright statement’ shall be
taken to read ‘copyright or other statement pertaining to Rights’.

The following new definition shall be added to the Definitions section of
the Apache License:

“Rights” means copyright and any similar right including design right
(whether registered or unregistered), rights in semiconductor
topographies (mask works) and database rights (but excluding Patents and
Trademarks).

The following definitions shall replace the corresponding definitions in
the Apache License:

“License” shall mean this Solderpad Hardware License version 2.1, being
the terms and conditions for use, manufacture, instantiation, adaptation,
reproduction, and distribution as defined by Sections 1 through 9 of this
document.

“Licensor” shall mean the owner of the Rights or entity authorized by the
owner of the Rights that is granting the License.

“Derivative Works” shall mean any work, whether in Source or Object form,
that is based on (or derived from) the Work and for which the editorial
revisions, annotations, elaborations, or other modifications represent,
as a whole, an original work of authorship or design. For the purposes of
this License, Derivative Works shall not include works that remain
reversibly separable from, or merely link (or bind by name) or physically
connect to or interoperate with the Work and Derivative Works thereof.

“Object” form shall mean any form resulting from mechanical
transformation or translation of a Source form or the application of a
Source form to physical material, including but not limited to compiled
object code, generated documentation, the instantiation of a hardware
design or physical object or material and conversions to other media
types, including intermediate forms such as bytecodes, FPGA bitstreams,
moulds, artwork and semiconductor topographies (mask works).

“Source” form shall mean the preferred form for making modifications,
including but not limited to source code, net lists, board layouts, CAD
files, documentation source, and configuration files.

“Work” shall mean the work of authorship or design, whether in Source or
Object form, made available under the License, as indicated by a notice
relating to Rights that is included in or attached to the work (an
example is provided in the Appendix below).

2. Grant of License. Subject to the terms and conditions of this License,
each Contributor hereby grants to You a perpetual, worldwide,
non-exclusive, no-charge, royalty-free, irrevocable license under the
Rights to reproduce, prepare Derivative Works of, make, adapt, repair,
publicly display, publicly perform, sublicense, and distribute the Work
and such Derivative Works in Source or Object form and do anything in
relation to the Work as if the Rights did not exist.

APPENDIX

Copyright 2023 CEA*
*Commissariat a l'Energie Atomique et aux Energies Alternatives (CEA)

SPDX-License-Identifier: Apache-2.0 WITH SHL-2.1

Licensed under the Solderpad Hardware License v 2.1 (the “License”); you
may not use this file except in compliance with the License, or, at your
option, the Apache License version 2.0. You may obtain a copy of the
License at

https://solderpad.org/licenses/SHL-2.1/

Unless required by applicable law or agreed to in writing, any work
distributed under the License is distributed on an “AS IS” BASIS, WITHOUT
WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied. See the
License for the specific language governing permissions and limitations
under the License.