Version 3.2.11

This is a pure bugfix release to address issues on setups with multiple fans/extruders assigned to multiple tools.

Version 3.2.11

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2 or later.

Bug fixes:

• When multiple tools used the same extruder or fan only the first tool using it was considered
• When multiple beds/chambers used the same heater status was only updated for the first one

Version 3.2.10

Version 3.2.10

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2 or later.
• Flashing this release will reset the configuration to defaults

Limitations

• Due to the lack of RAM this build will not run on version 1 or early version 2 PanelDue boards that use the ATSAM3S2B chip.
  • Version 1.0, 1.1 and earlier v2 PanelDue: ATSAM3S2B processor (64MHz, 32kb RAM, 128kB flash) - these are the ones that the new firmware probably won't run on.
  • Version 2 PanelDue manufactured from August 2016: ATSAM3S4B processor (64MHz, 48kb RAM, 256kb flash). Will run the new firmware, but not as fast as version 3 will.
  • Version 3 PanelDue, including all 5i and 7i: ATSAM4S4B processor, 120MHz, 64kB RAM, 256kb flash. Will run the new firmware.

Changed:

• Added Italian language - thanks @brisma
• If no tool is selected show fan speed of Fan 0
• Add a new setting so multiple heaters of one tool can be combined into one (as it was until 3.2.6)

Bug fixes:

• Try a few graphic glitches

Release 3.2.9

Version 3.2.9

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2 or later.

Limitations

• Due to the lack of RAM this build will not run on version 1 or early version 2 PanelDue boards that use the ATSAM3S2B chip.
  • Version 1.0, 1.1 and earlier v2 PanelDue: ATSAM3S2B processor (64MHz, 32kb RAM, 128kB flash) - these are the ones that the new firmware probably won't run on.
  • Version 2 PanelDue manufactured from August 2016: ATSAM3S4B processor (64MHz, 48kb RAM, 256kb flash). Will run the new firmware, but not as fast as version 3 will.
  • Version 3 PanelDue, including all 5i and 7i: ATSAM4S4B processor, 120MHz, 64kB RAM, 256kb flash. Will run the new firmware.

Changed:

• Removed obsolete code
• Replaced custome code by C-standard impl

Bug fixes:

• Fix heater state of bed heater being temporarily applied to all but the first tool
• When STOP button was pressed PanelDue never really got into "Initializing" state again
• When OM key "tools" updated all tools would temporarily show 0.0°C as current temp

Release 3.2.8

This is mainly a bugfix release to address bugs introduced in 3.2.6 and 3.2.7

Version 3.2.8

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2 or later

Limitations

• Due to the lack of RAM this build will not run on version 1 or early version 2 PanelDue boards that use the ATSAM3S2B chip.
  • Version 1.0, 1.1 and earlier v2 PanelDue: ATSAM3S2B processor (64MHz, 32kb RAM, 128kB flash) - these are the ones that the new firmware probably won't run on.
  • Version 2 PanelDue manufactured from August 2016: ATSAM3S4B processor (64MHz, 48kb RAM, 256kb flash). Will run the new firmware, but not as fast as version 3 will.
  • Version 3 PanelDue, including all 5i and 7i: ATSAM4S4B processor, 120MHz, 64kB RAM, 256kb flash. Will run the new firmware.

Changed:

• Added Ukrainian translation (disabled for now) - thanks vitaliy172
• Removed unused fonts
• Move heater status into bed and chamber only to save some RAM
• Support multiplexed heaters
• Add color gradient to buttons in Dark 1 theme

Bug fixes:

• Fan used fans[].actualValue instead of fans[].requestedValue
• Color gradient for heater-fault was broken on Light theme
• Additional bed and heater buttons alwaysed controlled the first bed or chamber respectively
• Extrusion factor could be shown for an element without an extruder
• Active/standby controls for tools with multiple heaters always set all heaters of this tool

Release 3.2.7

Version 3.2.7

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2 or later. It will partially work with RepRapFirmware 3.1.1 but not with any older version.

Limitations

• Due to the lack of RAM this build will not run on version 1 or early version 2 PanelDue boards that use the ATSAM3S2B chip.
  • Version 1.0, 1.1 and earlier v2 PanelDue: ATSAM3S2B processor (64MHz, 32kb RAM, 128kB flash) - these are the ones that the new firmware probably won't run on.
  • Version 2 PanelDue manufactured from August 2016: ATSAM3S4B processor (64MHz, 48kb RAM, 256kb flash). Will run the new firmware, but not as fast as version 3 will.
  • Version 3 PanelDue, including all 5i and 7i: ATSAM4S4B processor, 120MHz, 64kB RAM, 256kb flash. Will run the new firmware.

Changed:

• Fill left screen estate with addtional bed and chamber heaters
• Support tools with multiple heaters
• Reduced flickering while initialization
• Bring minimum and maximum axes count in line with RRF
• Respect spindle minimum RPM

Bug fixes:

• First bed/chamber/tool/axis could not be removed
• On 4.3" macro shortcut buttons would not show up even if there was enough space left
• If more tools or beds that can be displayed were defined this could lead to illegal memory access
• Fix possible memory leaks in object model representation

Release 3.2.6

Version 3.2.6

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2-beta1 or later. It will partially work with RepRapFirmware 3.1.1 but not with any older version.

Limitations

• Hardware limitations: see Release 3.2.0
• Reprint/resimulate button on DSF setups will only work with DSF 3.2-beta5 (or RC1 whatever will be version after beta4)

Changed:

• Improve data structures to hold the ObjectModel data
• Use more of the common code base from RRFLibraries to get rid of duplicate code

Bug fixes:

• Fix memory leaks
• Show fan value of current tool instead of hard-coded fan with number 0

UPDATE 2020-12-16

All binaries updated to 3.2.6+1 to fix the following two bugs:

• Fix reprint/resimulate button not sending the correct command (3.2.6+1)
• Fix reprint/resimulate button not hiding when mainboard restarts (3.2.6+1)

Release 3.2.5

Version 3.2.5

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2-beta1 or later. It will partially work with RepRapFirmware 3.1.1 but not with any older version.

Limitations

• Hardware compatibility: see earlier v3.2.x releases
• There will be no reliable status updates coming from RepRapFirmware while waiting for heaters to reach temperature (and some other cases) before RRF 3.2-beta3.2.
• Reprint/resimulate button on DSF setups will only work with DSF 3.2-beta5 (or RC1 whatever will be version after beta4)

Changed:

• Tool active/standby temp is now the one from the tool instead of the heater

Bug fixes:

• Unnecessary refresh for each printer state change
• Forcing an update on a text field could get stuck
• Title in Alert/Message window was hidden
• Reprint/resimulate failed for filenames with more than 40 characters (including path)
• Reprint/resimulate button collided with axes positions on 5"/7" screens
• If a heater was shared between tools/beds/chambers current temp was only updated for the first one displayed
• Homing status was not updated after a reset of the panel
• Screensaver left pixels with the background color of the underlying screen in the corners

Release 3.2.4

Version 3.2.4

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2-beta1 or later. It will partially work with RepRapFirmware 3.1.1 but not with any older version.

Limitations

• Due to the lack of RAM this build will not run on version 1 or early version 2 PanelDue boards that use the ATSAM3S2B chip.
  • Version 1.0, 1.1 and earlier v2 PanelDue: ATSAM3S2B processor (64MHz, 32kb RAM, 128kB flash) - these are the ones that the new firmware probably won't run on.
  • Version 2 PanelDue manufactured from August 2016: ATSAM3S4B processor (64MHz, 48kb RAM, 256kb flash). Will run the new firmware, but not as fast as version 3 will.
  • Version 3 PanelDue, including all 5i and 7i: ATSAM4S4B processor, 120MHz, 64kB RAM, 256kb flash. Will run the new firmware.
• There will be no reliable status updates coming from RepRapFirmware while waiting for heaters to reach temperature (and some other cases) before RRF 3.2-beta3.2.

New and changed features:

• Add button to reprint/resimulate last file

Bug fixes:

• For PanelDue v2 the wrong linker script was used resulting in PanelDueFirmware not booting
• After a print/simulation has finished some of the elements partially remained on screen

Release 3.2.3

Version 3.2.3

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2-beta1 or later. It will partially work with RepRapFirmware 3.1.1 but not with any older version.
• Flashing this release will reset the configuration to defaults

Limitations

• Due to the lack of RAM this build will not run on version 1 or early version 2 PanelDue boards that use the ATSAM3S2B chip.
  • Version 1.0, 1.1 and earlier v2 PanelDue: ATSAM3S2B processor (64MHz, 32kb RAM, 128kB flash) - these are the ones that the new firmware probably won't run on.
  • Version 2 PanelDue manufactured from August 2016: ATSAM3S4B processor (64MHz, 48kb RAM, 256kb flash). Will run the new firmware, but not as fast as version 3 will.
  • Version 3 PanelDue, including all 5i and 7i: ATSAM4S4B processor, 120MHz, 64kB RAM, 256kb flash. Will run the new firmware.
• There will be no reliable status updates coming from RepRapFirmware while waiting for heaters to reach temperature (and some other cases) before RRF 3.2-beta3.2.

New and changed features:

• Sped up intialization phase
• Increased poll rate from 1s to 500ms and add adaptive slow down if too many out-of-buffer occur

Bug fixes:

• Command input field did not show inserted character

Release 3.2.2

Version 3.2.2

Upgrade Notes:

• This release is compatible with RepRapFirmware 3.2-beta1 or later. It will partially work with RepRapFirmware 3.1.1 but not with any older version.
• Flashing this release will reset the configuration to defaults

Limitations

• Due to the lack of RAM this build will not run on version 1 or early version 2 PanelDue boards that use the ATSAM3S2B chip.
  • Version 1.0, 1.1 and earlier v2 PanelDue: ATSAM3S2B processor (64MHz, 32kb RAM, 128kB flash) - these are the ones that the new firmware probably won't run on.
  • Version 2 PanelDue manufactured from August 2016: ATSAM3S4B processor (64MHz, 48kb RAM, 256kb flash). Will run the new firmware, but not as fast as version 3 will.
  • Version 3 PanelDue, including all 5i and 7i: ATSAM4S4B processor, 120MHz, 64kB RAM, 256kb flash. Will run the new firmware.
• There will be no reliable status updates coming from RepRapFirmware while waiting for heaters to reach temperature (and some other cases) before RRF 3.2-beta4.

New and changed features:

• Babystep amount is configurable from preset values
• When babystep buttons are pressed the value on the screen will be updated immediately and will be overwritten
  with the actual value on the next status update (usually these values should be equal anyway)
• Feedrate for move buttons is configuratble from preset values
• PanelDueFirmware does no longer distinguish between responses to M409 with and without K parameter. This prevents
  issues if values are moved from live to detail response or vice versa
• Provide interface for RepRapFirmware to reset as well as erase and reset the PanelDue
• Preparations to show more than one bed/one chamber

Bug fixes:

• Babystepping amount was not initialized

Bug fixes since 3.2.1:

• Setting babystep amount to the lowest value would invalidate stored settings on next start of PanelDue
• A chamber could steal the second slot and status/temperatures would alternate between the tool and the chamber
• A null pointer dereference could occur when RRF was restarted leading to a reset of PanelDueFirmware
• State "Initializing" was replaced too early by "Idle"
• Fetching the first bed/heater would not filter out invalidated entries
• Under rare cicumstances it could happen that selectin a bed/chamber or setting temperatures for these could
  cause a restart of PanelDueFirmware