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Copy pathUSB_C.kicad_mod
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USB_C.kicad_mod
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(footprint "USB_C" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 5E39FFBD)
(descr "http://www.connfly.com/userfiles/image/UpLoadFile/File/2013/5/6/DS1095.pdf")
(tags "USB-A receptacle horizontal through-hole")
(fp_text reference "REF**" (at -6.927114 -7.943916) (layer "F.SilkS")
(effects (font (size 0.6 0.6) (thickness 0.1)) (justify left))
(tstamp 91223ff2-bc82-4118-a548-81e6504d9ff0)
)
(fp_text value "USB_C" (at 3.5 7) (layer "F.Fab") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 33076439-9ee7-4643-96c1-4ee12910bce7)
)
(fp_text user "CL" (at 0 3.24 270 unlocked) (layer "User.1")
(effects (font (size 0.6 0.6) (thickness 0.1)))
(tstamp 49bdc35f-8abe-4998-993c-c29664e006b4)
)
(fp_text user "Board Edge" (at -5.5 3.24 315 unlocked) (layer "User.1")
(effects (font (size 0.6 0.6) (thickness 0.1)))
(tstamp 96fae093-da7a-47c2-bcdd-741a0659fe3c)
)
(fp_line (start -4.7 -5.001368) (end -4.7 -3.001368) (layer "F.SilkS") (width 0.12) (tstamp 05561524-bdff-4deb-924b-d42042e1cebc))
(fp_line (start 4.7 -1) (end 4.7 -0.1) (layer "F.SilkS") (width 0.12) (tstamp 0c1f2875-10d9-4ac1-84eb-4ad2ab96bb00))
(fp_line (start -4.7 -1) (end -4.7 -0.1) (layer "F.SilkS") (width 0.12) (tstamp d9d09d03-11ab-4530-9c51-be82f01eb3a1))
(fp_line (start 4.7 -5.001368) (end 4.7 -3.001368) (layer "F.SilkS") (width 0.12) (tstamp e6403647-5283-4413-8325-659c382fd126))
(fp_line (start 3.706572 -6.3) (end -3.678785 -6.3) (layer "F.SilkS") (width 0.12) (tstamp f28ec2ed-41a6-417a-8797-d65a79f7edef))
(fp_rect (start -7.2 -8.9) (end 7.2 0.7) (layer "F.CrtYd") (width 0.05) (fill none) (tstamp 16a5ef68-e208-4c48-88aa-582cbc81a7e4))
(fp_line (start -4.47 0.5) (end 4.47 0.5) (layer "F.Fab") (width 0.1) (tstamp 36c0d6e9-58d7-41be-830f-a65f002a91de))
(fp_line (start 4.47 -7.4) (end 4.47 0.5) (layer "F.Fab") (width 0.1) (tstamp 81f101ca-7931-4c69-8cd5-3ff23da29950))
(fp_line (start -4.47 -7.4) (end -4.47 0.5) (layer "F.Fab") (width 0.1) (tstamp bb8a5aa9-b2a3-41fa-9b67-a897ec500428))
(fp_line (start -4.47 -7.4) (end 4.47 -7.4) (layer "F.Fab") (width 0.1) (tstamp f3158bb8-9d95-44a6-bd5d-150b19ab33ac))
(fp_line (start -8 0) (end 8 0) (layer "User.1") (width 0.1) (tstamp 2462f40f-54a5-4d83-9347-03271f118f2d))
(fp_line (start 0 5.08) (end 0 -10.16) (layer "User.1") (width 0.12) (tstamp acf51796-f1ba-45b4-8238-51c9e923add0))
(fp_line (start -8 0) (end -3 5) (layer "User.1") (width 0.12) (tstamp f849dd6c-55ec-42b2-bb18-d150f7ff6cbd))
(pad "1" thru_hole circle (at -2.89 -5.701368) (size 1.25 1.25) (drill 0.65) (layers *.Cu) (remove_unused_layers) (tstamp 13a3e5e2-33a4-454f-bae2-ddfbfe2eb2e0))
(pad "1" smd roundrect (at 2.45 -7.146368) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 13eaf1bf-f114-44bc-9984-c7adb27a3ccd))
(pad "1" smd roundrect (at -2.45 -7.146368) (size 0.6 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 4c0e5299-8d0f-4be9-8379-05b82e7eda6c))
(pad "1" thru_hole circle (at 2.89 -5.701368) (size 1.25 1.25) (drill 0.65) (layers *.Cu) (remove_unused_layers) (tstamp b95a32f7-0116-4f70-96fc-8028025a8f04))
(pad "2" smd roundrect (at -0.25 -8.3 90) (size 0.3 1.29) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.25) (tstamp 7cfbcfd9-012c-450e-9a9b-d3a733d5a005))
(pad "2" smd roundrect (at 0.25 -7.4) (size 0.3 1.85) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp acb4a449-dbae-498d-81ec-af2752d331be))
(pad "2" smd roundrect (at -0.75 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp b12c68eb-e3f8-47b0-8b79-6420b3103f7b))
(pad "2" smd roundrect (at -0.75 -7.4) (size 0.3 1.85) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp b4b30d57-903b-43ba-9f08-b5782b68dd8f))
(pad "2" smd roundrect (at 0.25 -8.2) (size 0.3 1) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.25) (tstamp ba1ff066-cd72-4f6a-bb08-067b8b93461c))
(pad "2" smd roundrect (at 0.25 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ba555ad4-803d-4c62-a3b9-9460a9f10ec4))
(pad "3" smd roundrect (at 0.25 -6 90) (size 0.3 1.29) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.25) (tstamp 1f419771-9e32-4166-b1bd-13b631613585))
(pad "3" smd roundrect (at 0.75 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 2cffe821-cc1f-42d5-b42b-2eb96e726e2b))
(pad "3" smd roundrect (at -0.25 -6.9) (size 0.3 1.85) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp 68b7f69c-6db4-4f6f-b4f4-c81516e9494d))
(pad "3" smd roundrect (at -0.25 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 75170729-c55d-4cb9-8969-77321d5b1f21))
(pad "3" smd roundrect (at 0.75 -6.9) (size 0.3 1.85) (layers "F.Cu") (roundrect_rratio 0.25) (tstamp b7d75834-1ff6-4c84-bf3b-ef8b53d05986))
(pad "3" smd roundrect (at 0.75 -8.2) (size 0.3 1) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.25) (tstamp e0620b43-1cd0-4ced-920a-89cf50a9cea5))
(pad "4" smd roundrect (at -3.678785 -6.825) (size 0.8 0.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.25) (tstamp 388ad8ef-ed04-40fe-8a5c-6e6ec16f8984))
(pad "4" smd roundrect (at 3.25 -7.2) (size 0.6 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 3e0ee9de-69cc-4d14-ba53-500f2015c85a))
(pad "4" smd roundrect (at 3.706572 -6.825) (size 0.8 0.6) (layers "F.Cu" "F.Paste") (roundrect_rratio 0.25) (tstamp a8a10ef7-69b6-473b-9d60-15b470291059))
(pad "4" smd roundrect (at -3.25 -7.2) (size 0.6 1.35) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ad58ca73-d3b3-46fa-85f9-b23ddc8a7ddd))
(pad "5" smd roundrect (at -5.846965 -2.051368) (size 2.4 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25) (tstamp 0b03807d-e15b-4f68-b7f1-3f0fc6fa546b))
(pad "5" thru_hole oval (at -4.32 -2.051368) (size 1 1.6) (drill oval 0.6 1.2) (layers *.Cu *.Mask) (tstamp 2443e188-6bbe-423b-b00d-1298af92a849))
(pad "5" thru_hole oval (at 4.32 -6.231368) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask) (tstamp 692b5c95-d53a-4839-a13e-32f4dc313198))
(pad "5" smd roundrect (at 5.846965 -6.219573) (size 2.4 2.1) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25) (tstamp 6bd0d48a-86f4-459f-b851-37491decb2f2))
(pad "5" smd roundrect (at -5.846965 -6.219573) (size 2.4 2.1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6e279b9d-86c5-4a21-83e2-f16d61c46958))
(pad "5" thru_hole oval (at -4.32 -6.231368) (size 1 2.1) (drill oval 0.6 1.7) (layers *.Cu *.Mask) (tstamp 733c6384-384b-4f91-8efa-598e4cea8df9))
(pad "5" thru_hole roundrect (at 0 -2.331368 180) (size 6 4) (drill oval 3.5 3) (layers *.Cu *.Mask) (roundrect_rratio 0.25) (tstamp 791f6dd5-89b2-41f4-9cac-5fe994011260))
(pad "5" smd roundrect (at 5.846965 -2.051368) (size 2.4 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a3053bc8-3f81-472d-91b8-e6875fe69d73))
(pad "5" thru_hole oval (at 4.32 -2.051368) (size 1 1.6) (drill oval 0.6 1.2) (layers *.Cu *.Mask) (tstamp a44cd768-7246-47e3-973e-290d12fb6552))
(pad "5" smd roundrect (at 5.846965 -2.051368) (size 2.4 1.6) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25) (tstamp a61d8230-2ac1-4eeb-8704-0bfa88bb07b1))
(pad "5" smd roundrect (at -5.846965 -6.219573) (size 2.4 2.1) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25) (tstamp a6c46fb6-495a-498d-981f-3cef305421c1))
(pad "5" smd roundrect (at -5.846965 -2.051368) (size 2.4 1.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a8fe0f49-3222-4d44-be02-b82cd9343298))
(pad "5" smd roundrect (at 5.846965 -6.219573) (size 2.4 2.1) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp e2166d6a-99e6-43ba-86ae-82fc3e2b5a8f))
(pad "A5" smd roundrect (at -1.25 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 69a15089-93cf-47ef-ab20-1bf987c11c82))
(pad "A8" smd roundrect (at 1.25 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a2cb058c-9794-44ec-881e-72cea82d6ef5))
(pad "B5" smd roundrect (at 1.75 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 04f02611-be68-4cf8-9652-5f700a545166))
(pad "B8" smd roundrect (at -1.75 -7.146368) (size 0.3 1.45) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 5f2e9d6f-7de0-4131-bb74-2e49cda5ce89))
(model "USB-C-SMD_TYPE-C-6PIN-2MD-073.step"
(offset (xyz 0 3 1.65))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)