|
2 | 2 | title: "Hardware" |
3 | 3 | description: "" |
4 | 4 | --- |
| 5 | + |
5 | 6 | # Pictures (r1) |
6 | | -## Board |
| 7 | +## Main PCB |
| 8 | +[](TB-MAIN_2.0.P_Top.png) |
| 9 | +[](TB-MAIN_2.0.P_Bottom.png) |
| 10 | + |
| 11 | +## UX PCB |
| 12 | +[](TB-UX-PCB_1.0.R_Top.png) |
| 13 | +[](TB-UX-PCB_1.0.R_Bottom.png) |
| 14 | + |
7 | 15 |
|
8 | 16 |
|
9 | | -# Parts |
| 17 | +# Testpoints |
10 | 18 |
|
11 | | -## TAS2X63 TI 458 AXGJ G3 |
12 | | -## NXP IW416HNA1C KJ1GC.01 JEAD2509 |
13 | | -## NXP 823-A0 452n02 |
14 | | -## MIMXRT1061 DVL6B 1N00X CTQG2502B |
15 | | -## Winbond W956A8MBYA5I 6331A5100ZV2 510PCA TWN |
16 | | -## Rayson RS70B32G4 S15G F3010B AF14 |
17 | | -## Winbond 250128JYSQ 2518 |
| 19 | +| Testpoint | Function | |
| 20 | +| :-- | :-- | |
| 21 | +| **TP510** | Serial TX | |
| 22 | +| **TP511** | Serial RX? (no response) | |
| 23 | +| **TP512** | Serial GND | |
18 | 24 |
|
19 | 25 | # Table |
20 | 26 |
|
21 | 27 | | Chip Designation | Manufacturer | Function (Assumed) | Datasheet (PDF) | |
22 | 28 | | :-- | :-- | :-- | :-- | |
23 | | -| **TAS2X63 TI 458 AXGJ G3** | Texas Instruments | Audio amplifier (TAS2x63 series, very likely TAS2563) | [TI TAS2563 PDF] | |
24 | | -| **IW416HNA1C KJ1GC.01 JEAD2509** | NXP | WiFi/Bluetooth transceiver (IW416 series) | [NXP IW416 PDF] | |
25 | | -| **823-A0 452n02 (NXP)** | NXP | power management IC | https://www.nxp.com/docs/en/data-sheet/PM823.pdf page:45 | |
26 | | -| **MIMXRT1061 DVL6B 1N00X CTQG2502B** | NXP | ARM Cortex-M7 MCU (RT1060 family) | [NXP MIMXRT1061 PDF] | |
27 | | -| **Winbond W956A8MBYA5I 6331A5100ZV2 510PCA TWN** | Winbond | 512Mb DDR3 SDRAM | [Winbond W956A8MBYA5I PDF] | |
28 | | -| **Rayson RS70B32G4 S15G F3010B AF14** | Rayson | 32GB 2.7V~3.6V eMMC 5.1 310/190 MB/s TFBGA-153(11.5x13) Memory (ICs) ROHS | [LCSC](https://www.lcsc.com/datasheet/C22375657.pdf) | |
29 | | -| **Winbond 250128JYSQ 2518** | Winbond | 128Mb SPI NOR Flash | [Winbond W25Q128JVSQ PDF] | |
30 | | - |
31 | | -## Notes \& Corrections |
32 | | - |
33 | | -- For the **823-A0 452n02** chip from NXP, it is most likely a custom part or a sub-module with no public datasheet available. |
34 | | -- All other chips are in the correct manufacturer families and the part numbers match the visible markings on the board. |
35 | | -- The Winbond number **250128JYSQ** should correctly read as **W25Q128JVSQ**, which is the common Winbond 128Mb SPI Flash IC. |
36 | | -- For the TI audio chip, **TAS2563** is very likely the correct assignment, as the ending numbers/appearance match. Datasheets for TAS2x63 and TAS2563 are relevant. |
37 | | - |
38 | | -1. **TI TAS2563**: https://www.ti.com/product/TAS2563[^1] |
39 | | -2. **NXP IW416**: https://www.nxp.com/docs/en/data-sheet/IW416.pdf[^2] |
40 | | -3. **NXP MIMXRT1061**: https://www.nxp.com/docs/en/data-sheet/IMXRT1060CEC.pdf[^3] |
41 | | -4. **Winbond W956A8MBYA5I**: https://www.winbond.com/resource-files/w956a8mbya5i.pdf[^4] |
42 | | -5. **Winbond W25Q128JVSQ**: https://www.winbond.com/resource-files/w25q128jv spi revc 02122019.pdf |
| 29 | +| **TAS2X63 TI 458 AXGJ G3** | Texas Instruments | Audio amplifier (likely TAS2563) | [TI TAS2563 PDF][1] | |
| 30 | +| **IW418HNA1C** | NXP | Dual-band WiFi 4 + Bluetooth 5.2 | [NXP IW416 PDF][2] | |
| 31 | +| **823-A0** | NXP | PMIC – Dual 1.5A Buck + 525 mA LDO | [NXP PM823 PDF][3] | |
| 32 | +| **MIMXRT1061 DVL6B** | NXP | ARM Cortex-M7 MCU (RT1060 family) | [NXP MIMXRT1061 PDF][4] | |
| 33 | +| **W956A8MBYA5I** | Winbond | 64Mbit HyperRAM 200 MHz 35 ns | [Winbond W956A8MBYA5I PDF][5] | |
| 34 | +| **RS70B32G4S15G** | Rayson | 32GB eMMC 5.1 TFBGA-153 | [Rayson RS70B32G4S15G PDF][6] | |
| 35 | +| **W25Q128JVSIQ** | Winbond | 128Mbit SPI NOR Flash SOIC-8 | [Winbond W25Q128JVSIQ PDF][7] | |
| 36 | + |
| 37 | +# Notes & Corrections |
| 38 | + |
| 39 | +- **TAS2X63** marking strongly suggests TI **TAS2563**, used for Class-D audio amplification. |
| 40 | +- **823-A0** refers to NXP’s PM823, a power management IC with integrated buck converters and LDO. |
| 41 | +- **W956A8MBYA5I** is a **64Mbit HyperRAM** with HyperBus interface. |
| 42 | +- **RS70B32G4S15G** is a 32GB eMMC 5.1 module. |
| 43 | +- **W25Q128JYSQ** marking corresponds to **W25Q128JVSIQ**, a 128Mbit SPI NOR Flash IC. |
| 44 | + |
| 45 | +[1]: https://www.ti.com/product/TAS2563 |
| 46 | +[2]: https://www.nxp.com/products/IW416 |
| 47 | +[3]: https://www.mouser.de/ProductDetail/NXP-Semiconductors/PM823UK-A0CZ?qs=TuK3vfAjtkVJFmQ7TAMyAw%3D%3D |
| 48 | +[4]: https://www.nxp.com/docs/en/data-sheet/IMXRT1060CEC.pdf |
| 49 | +[5]: https://www.digikey.de/de/products/detail/winbond-electronics/W956A8MBYA5I/15181915 |
| 50 | +[6]: https://www.lcsc.com/product-detail/C22375657.html?s_z=n_RS70B32G4 |
| 51 | +[7]: https://www.lcsc.com/product-detail/C97521.html?s_z=n_25Q128JV |
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