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Unreliable during heavy load #10
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Hello, first of all congrats for the project. If the problem if thermal, we can design together an enclosure w/ embed heat-sink and ventilation. |
@will127534 Hi! |
@Brat0x2 |
@will127534 Thanks for your reply! It should be a heatsink? Maybe with little fan? |
@Brat0x2 |
You need to ensure proper transfer of thermal energy from both top (heat sink) and bottom (solder to PCB plane with substantial copper area 3 exposed to air) of the chip. To operate within the 0-70 deg. C operating conditions of the datasheet Semtech specifies 100 cm2 copper below and heatsink on top. Let me quote from the datasheet:
Source: SX1308 Datasheet, paragraph 2 And from the thermal application note:
Source: SX1308 Thermal Dissipation: Technical Analysis and Recommendations, paragraph 3 |
@mikini That is a really useful data! From the measurement on "RPIZero" Gateway V3(not released yet), I measured about 50~55 degrees with a large heatsink and 60 degrees without, which is better than PicoCell GW without housing and with heat sink. Although I didn't run for 24 Hours, only for couple hours. Anyways, I'll do a experiment on RPI Gateway V3 later. |
Setup:
one RF98 Transmitter @ 432Mhz, transmitting 6-axis data (24byte+2byte header) per 100ms
one RPI-Gateway with full channel on
If I tested indoor, Gateway will output some error data, the full log is here
it seems that SX1301 will output some wrong data.
But I when I try it near the window(with some wind), the error goes away, so I believed that it is cause by thermal problem, maybe do some measurement later.
I've already added a heatsink on top of SX1301, but it seems not enough....
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